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Stencils universal 56 in 1 Kaisi 55 for reballing BGA IC chips

ID: 3527

Reference: 55

Condition: New product

Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating

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Data sheet

Warranty	1 month

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Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating

Template thickness: 0.15mm

Note: It is recommended to use solder paste (liquid tin)!

Kit contains:
- grid 4x16 (various pitch)
- grid 6x16 (various pitch)
- grid 8x15 (various pitch)
- grid 8x20 (various pitch)
- grid 8x25 (various pitch)
- grid 8x30 (various pitch)
- grid 8x33 (various pitch)
- grid 10x10 (various pitch)
- grid 10x15 (various pitch)
- grid 10x16 (various pitch)
- grid 14x14 (various pitch)
- grid 15x18 (various pitch)
- grid 16x14 (various pitch)
- grid 18x14 (various pitch)
- grid 18x18 (various pitch)
- grid 20x18 (various pitch)
- grid 20x20 (various pitch)
- grid 23x23 (various pitch)
- grid 24x24 (various pitch)
- grid 25x25 (various pitch)
- grid 30x20 (various pitch)
- grid 30x26 (various pitch)
- grid 30x30 (various pitch)