0.3-0.5
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Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
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Stencils universal 16 in 1 Amaoe 0.3-0.5 for reballing BGA IC chips
Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
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Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
Template thickness: 0.12mm
Note: It is recommended to use solder paste (liquid tin)!
Kit contains:
- grid 23x23, pitch 0.30mm
- grid 50x50, pitch 0.30mm
- grid 22x22, pitch 0.35mm
- grid 32x32, pitch 0.35mm
- grid 48x48, pitch 0.35mm
- grid 18x18, pitch 0.40mm
- grid 32x32, pitch 0.40mm
- grid 48x48, pitch 0.40mm
- grid 18x18, pitch 0.50mm
- grid 38x38, pitch 0.50mm
- grid 16x15 at an angle of 45°, pitch 0.35mm
- grid 35x35 at an angle of 45°, pitch 0.35mm
- grid 12x13 at an angle of 45°, pitch 0.40mm
- grid 35x35 at an angle of 45°, pitch 0.40mm
- grid 16x19 shifted rows, pitch 0.40mm
- grid 25x25 shifted rows, pitch 0.40mm
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