Magnetic test probes (test leads, multimeter probes) with 4mm banana...
Cutting wire with high toughness and hardness Relife RL-059C, diameter...
Cutting wire with high toughness and hardness Relife RL-059B, diameter...
Cutting wire with high toughness and hardness Relife RL-059A, diameter...
Soldering station (soldering iron) BaKon BK950D, 180-450°C, 50W, T12 series
IC Chip ITE IT5125VG-192 CXO (package: BGA-128), embedded controller, new
IC Chip Texas Instruments CSD87501LT (package: LGA-10), 30V/14A dual...
IC Chip Texas Instruments TPS65994ADRSLR (package: QFN-48), dual port...
IC Chip Texas Instruments TPS65994ADYBGR (package: BGA-50), dual port...
Lead balls (Soldering Balls) Sn63/Pb37, 0.76mm, 25000 pcs
Hot air rework station and soldering...
Products for BGA reballing - stencils (templates), reballing stations, tin solder balls, solder fluxes, tin solder paste, solder mask, thermal reflective foil
Subcategories
Single stencils for reball BGA chips
Sets stencils for reball BGA chips
Lead balls for reball
Reballing station
Lead balls (Soldering Balls) Sn63/Pb37, 0.76mm, 25000 pcs
Stencils (templates) 35 in 1 Kaisi A90 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 40 in 1 Kaisi A418 for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size N18P-G0-MP-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Kit of platform and 6 pieces stencils (templates) Amaoe for reballing (reball) EMMC EMCP UFS BGA IC chips with direct heating
Stencils (templates) Amaoe 25 in 1 for reballing (reball) Apple MacBook Pro A1706 / A1707 BGA IC chips with direct heating
Stencils (templates) chip size for reballing (reball) BGA memory chips with direct heating, 14 pieces
Stencil (template) chip size GDDR5X for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size SRGKK for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Stencil (template) with flaw chip size V810C390 for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) chip size GK110-300-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size SRG0V for reballing (reball) Intel BGA IC chips with direct heating
Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 33 in 1 Kaisi A508 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 39 in 1 Kaisi A482 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 28 in 1 Kaisi A467 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 16 in 1 BGA153 / BGA162 / BGA221 / BGA254 for reballing (reball) BGA IC chips with direct heating