Cables with Micro JST (Molex PicoBlade) connectors male and female, 2...
Repair stand (third hand, helping hands, holder) with 3 flexible arms...
IC Chip Samsung KLMAG2GEND-B031 (package: BGA-153), 16GB (128Gb) eMMC...
Type-C USB (USB-C) connector Galaxy-S21-S22-S23, female (jack), 12+12...
50mm PVC heat shrink film (tube, sleeve, wrap) for packing (insulating)...
Charging module (board) 1S 1A 4.2V for charging and discharging of...
USB Power Delivery PD3.0 trigger 20V 5A 100W with USB Type-C (USB-C)...
Digital multimeter Fluke 15B MAX with LCD display 4 digits (6000 counts)
Piercing test probes (acupuncture probes, test leads, multimeter probes)...
Type-C USB (USB-C) connector JK1-371, female (jack), 6+6+12 pins...
Products for BGA reballing - stencils (templates), reballing stations, tin solder balls, solder fluxes, tin solder paste, solder mask, thermal reflective foil
Subcategories
Single stencils for reball BGA chips
Sets stencils for reball BGA chips
Lead balls for reball
Reballing station
Pastes and Fluxes for reball and soldering of BGA chips
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size SRGKK for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Stencil (template) with flaw chip size V810C390 for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) chip size GK110-300-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size SRG0V for reballing (reball) Intel BGA IC chips with direct heating
Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 33 in 1 Kaisi A508 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 39 in 1 Kaisi A482 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 28 in 1 Kaisi A467 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 16 in 1 BGA153 / BGA162 / BGA221 / BGA254 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) chip size universal grid for reballing (reball) BGA IC chips with direct heating, 10 pieces, v2
Stencil (template) chip size MPC5554MZP132 for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size YM270BC4T4MFB for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size PS3-CPU for reballing (reball) Sony PlayStation 3 (PS3) BGA IC chips with direct heating
Stencil (template) 90x90mm DDR6 for reballing (reball) BGA IC chips
Stencil (template) chip size 215-0821060 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size 215-0852000 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size DDR6 for reballing (reball) BGA IC chips with direct heating
Stencil (template) 90x90mm universal (universal grid) for reballing (reball) BGA IC chips, 1 piece