Replacement (spare) soldering station handle T245 compatible with C245...
Replacement (spare) soldering station handle T210 compatible with C210...
Preheating station (preheating plate, preheating table) with timer,...
Repair stand (holder, fixture) for circuit boards (PCB) up to 30cm with...
Type-C USB (USB-C) connector TC-X280-T490, female (jack, receptacle),...
USB cables diagnostic tester (USB cables health tester, broken wire...
SMT adapter RT-TSOP56_SSOP56 TSOP56 / SSOP56 to DIP for programmer RT809H
Replacement (spare) mainboard for Sunkko 737G spot welding station
Double-sided adhesive PE foam tape (strip) 3x0.3mm 10m, black
Micro-B USB jack (connector) LENO-1...
Products for BGA reballing - stencils (templates), reballing stations, tin solder balls, solder fluxes, tin solder paste, solder mask, thermal reflective foil
Subcategories
Single stencils for reball BGA chips
Sets stencils for reball BGA chips
Lead balls for reball
Reballing station
Stencil (template) chip size GDDR5X for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size SRGKK for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Stencil (template) with flaw chip size V810C390 for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) chip size GK110-300-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size SRG0V for reballing (reball) Intel BGA IC chips with direct heating
Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 33 in 1 Kaisi A508 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 39 in 1 Kaisi A482 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 28 in 1 Kaisi A467 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 16 in 1 BGA153 / BGA162 / BGA221 / BGA254 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) chip size universal grid for reballing (reball) BGA IC chips with direct heating, 10 pieces, v2
Stencil (template) chip size MPC5554MZP132 for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size YM270BC4T4MFB for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size PS3-CPU for reballing (reball) Sony PlayStation 3 (PS3) BGA IC chips with direct heating
Stencil (template) 90x90mm DDR6 for reballing (reball) BGA IC chips
Stencil (template) chip size 215-0821060 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size 215-0852000 for reballing (reball) AMD/ATI BGA IC chips with direct heating