USB Type-C cables diagnostic tester (USB Type-C cables health tester,...
Original power adapter (charger) for Dell, 65W USB Power Delivery (USB...
IC Chip 4056E (package: SOP-8), 1A linear battery charger, new
IC Chip Texas Instruments TPS65988CE (package: VQFN-48), USB Type-C and...
IC Chip Texas Instruments TPS65987DDJ (package: VQFN-56), USB Type-C and...
3D analog joystick (sensor) for Sixaxis / DualShock 3 controller...
Low temperature solder paste (tin paste) Amaoe M11, Sn42 Bi58, 138°C...
Solder paste (tin paste) Amaoe M10, Sn63 Pb37, 183°C melting point, 50...
Cutting wire with high toughness and hardness Sunshine SS-051, diameter...
IC Chip ITE IT5571VG-128 CXO (package: BGA-128), embedded controller, new
AC power cable (AC power cord) CEE...
Products for BGA reballing - stencils (templates), reballing stations, tin solder balls, solder fluxes, tin solder paste, solder mask, thermal reflective foil
Subcategories
Single stencils for reball BGA chips
Sets stencils for reball BGA chips
Lead balls for reball
Reballing station
Stencils (templates) 53 in 1 Kaisi S5026 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 7 in 1 for reballing (reball) automotive BGA IC chips with direct heating
Stencil (template) 90x90mm i7-620M for reballing (reball) Intel BGA IC chips
Lead balls (Soldering Balls) Sn63/Pb37, 0.76mm, 25000 pcs
Stencils (templates) 35 in 1 Kaisi A90 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 40 in 1 Kaisi A418 for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size N18P-G0-MP-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Kit of platform and 6 pieces stencils (templates) Amaoe for reballing (reball) EMMC EMCP UFS BGA IC chips with direct heating
Stencils (templates) Amaoe 25 in 1 for reballing (reball) Apple MacBook Pro A1706 / A1707 BGA IC chips with direct heating
Stencils (templates) chip size for reballing (reball) BGA memory chips with direct heating, 14 pieces
Stencil (template) chip size GDDR5X for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size SRGKK for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Stencil (template) with flaw chip size V810C390 for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) chip size GK110-300-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size SRG0V for reballing (reball) Intel BGA IC chips with direct heating
Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 33 in 1 Kaisi A508 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 39 in 1 Kaisi A482 for reballing (reball) BGA IC chips with direct heating