U-UFS1 8in1 0.15
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Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
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Stencils Amaoe 8 in 1 BGA153 /162 /169 /200 /221 /254 /297 for reballing BGA IC chips
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
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Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Template thickness: 0.15mm
Note: It is recommended to use solder paste (liquid tin)!
Compatible IC chips:
- eMMC, eMCP, UFS, UMCP, LPDDR and others in BGA153, BGA162, BGA169, BGA200, BGA221, BGA254, BGA297 package
The set includes the following templates:
- BGA153 (13x11)
- BGA153 (13x11.5)
- BGA162
- BGA169
- BGA200
- BGA221
- BGA254
- BGA297
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