Stencils Amaoe 12 in 1 BGA60 to BGA315 for reballing BGA IC chips View larger

Stencils Amaoe 12 in 1 BGA60 to BGA315 for reballing BGA IC chips

3503

eMMC3 V2.0 12in1 0.15

New product

Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating

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14.60 лв.

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Warranty 1 month

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Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating

Template thickness: 0.15mm

Note: It is recommended to use solder paste (liquid tin)!

Compatible IC chips:
- eMMC, eMCP, UFS, UMCP, LPDDR, NAND, PCIe and others in BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA200, BGA221, BGA254, BGA297, BGA315 package

The set includes the following templates:
- BGA60
- BGA70
- BGA110
- BGA153
- BGA162
- BGA169
- BGA178
- BGA200
- BGA221
- BGA254
- BGA297
- BGA315

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Stencils Amaoe 12 in 1 BGA60 to BGA315 for reballing BGA IC chips

Stencils Amaoe 12 in 1 BGA60 to BGA315 for reballing BGA IC chips

Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating

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