eMMC3 V2.0 12in1 0.15
New product
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
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Stencils Amaoe 12 in 1 BGA60 to BGA315 for reballing BGA IC chips
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
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Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
Template thickness: 0.15mm
Note: It is recommended to use solder paste (liquid tin)!
Compatible IC chips:
- eMMC, eMCP, UFS, UMCP, LPDDR, NAND, PCIe and others in BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA200, BGA221, BGA254, BGA297, BGA315 package
The set includes the following templates:
- BGA60
- BGA70
- BGA110
- BGA153
- BGA162
- BGA169
- BGA178
- BGA200
- BGA221
- BGA254
- BGA297
- BGA315
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