DC-DC power supply module, Fast Charging support up to 65W, step down...
IC Chip uPI uP1961S (package: WQFN-16), dual-phase MOSFET driver with...
IC Chip Sinopower SM4503NH (package: DFN-8), 30V/80A N-channel...
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm...
IC Chip Sinopower SM4508NH (package: DFN-8), 30V/48A N-channel...
DC power cable with step up (boost) converter 5V USB Type-A connector to...
Portable measuring device (instrument) 3 in 1 ZOYI ZT-703S - digital DSO...
Soldering tip SH72-K, 400°C maximum operating temperature, for mini...
Soldering tip SH72-BC2, 400°C maximum operating temperature, for mini...
Soldering tip SH72-JL02, 400°C maximum operating temperature, for mini...
Single stencils for reball BGA chips
Stencil (template) chip size SRGKK for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) with flaw chip size V810C390 for reballing (reball) 10-th Gen Intel BGA IC chips with direct heating
Stencil (template) chip size GK110-300-A1 for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size SRG0V for reballing (reball) Intel BGA IC chips with direct heating
Stencil (template) chip size MPC5554MZP132 for reballing (reball) BGA IC chips with direct heating
Stencil (template) chip size YM270BC4T4MFB for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size PS3-CPU for reballing (reball) Sony PlayStation 3 (PS3) BGA IC chips with direct heating
Stencil (template) 90x90mm DDR6 for reballing (reball) BGA IC chips
Stencil (template) chip size 215-0821060 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size 215-0852000 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size DDR6 for reballing (reball) BGA IC chips with direct heating
Stencil (template) 90x90mm universal (universal grid) for reballing (reball) BGA IC chips, 1 piece
Stencil (template) chip size 215-0807018 for reballing (reball) AMD/ATI BGA IC chips with direct heating
Stencil (template) chip size KF20201102A004-3L for reballing (reball) nVidia BGA IC chips with direct heating
Stencil (template) chip size various types for reballing (reball) BGA IC chips, 1 piece
Stencil (template) 90x90mm D510-CPU for reballing (reball) Intel BGA IC chips
Stencil (template) 90x90mm NF-G6150-N-A2 for reballing (reball) nVidia BGA IC chips
Stencil (template) 90x90mm 82801IUX for reballing (reball) Intel BGA IC chips
Stencil (template) 90x90mm CG82NM10 for reballing (reball) Intel BGA IC chips
Stencil (template) 90x90mm BD82H61 for reballing (reball) Intel BGA IC chips
Stencil (template) 90x90mm BD82P55 for reballing (reball) Intel BGA IC chips