Stencils universal 7 in 1 Amaoe 0.5-0.8 for reballing BGA IC chips View larger

Stencils universal 7 in 1 Amaoe 0.5-0.8 for reballing BGA IC chips

3655

0.5-0.8

New product

Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating

More details

In stock


15.80 лв.

Add to wishlist

Data sheet

Warranty 1 month

More info

Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating

Template thickness: 0.20mm

Note: It is recommended to use solder paste (liquid tin)!

Kit contains:
- grid 30x30, pitch 0.50mm
- grid 30x30, pitch 0.55mm
- grid 30x30, pitch 0.60mm
- grid 38x38, pitch 0.65mm
- grid 35x35, pitch 0.70mm
- grid 35x35, pitch 0.75mm
- grid 38x38, pitch 0.80mm

Reviews

No customer comments for the moment.

Write a review

Stencils universal 7 in 1 Amaoe 0.5-0.8 for reballing BGA IC chips

Stencils universal 7 in 1 Amaoe 0.5-0.8 for reballing BGA IC chips

Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating

Write a review


Ask a question

NO registration required!

If the question you have has not yet been answered here, use the form below to ask something:

(optional)
*(Required to be notified when an answer is available)

15 other products in the same category:

Customers who bought this product also bought: