0.5-0.8
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Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
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Stencils universal 7 in 1 Amaoe 0.5-0.8 for reballing BGA IC chips
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
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Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Template thickness: 0.20mm
Note: It is recommended to use solder paste (liquid tin)!
Kit contains:
- grid 30x30, pitch 0.50mm
- grid 30x30, pitch 0.55mm
- grid 30x30, pitch 0.60mm
- grid 38x38, pitch 0.65mm
- grid 35x35, pitch 0.70mm
- grid 35x35, pitch 0.75mm
- grid 38x38, pitch 0.80mm
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