Double-sided adhesive tape (strip) for laptop (notebook) screen...
Cables with Molex 51146 (PanelMate) female connectors, 2 pins, 1.25mm...
SOP8 (SOIC8) 200mil ZIF socket for SMT/SMD mounting (soldering) on PCB
FFC cable (flexible flat cable) JC39-01699A for scanner section (CIS...
Stencils (templates) Amaoe 11 in 1 for reballing (reball) with direct...
Rechargeable battery US18650VTC6, 3000mAh 3.6V, 18650 (cylindrical with...
Stencils (templates) Amaoe 40 in 1 for reballing (reball) Samsung Galaxy...
Stencil (template) Amaoe E8835P for reballing (reball) Samsung Exynos...
Spare needles (needle tip, pin-tip) with M2.5 thread for test probes...
USB tester (USB meter, USB detector, USB doctor) 7 in 1 HiDANCE...
Sets stencils for reball BGA chips
Stencils (templates) Amaoe 11 in 1 for reballing (reball) with direct heating of BGA IC chips in Lenovo mobile devices
Stencils (templates) Amaoe 40 in 1 for reballing (reball) Samsung Galaxy A14 A25 A54 BGA IC chips with direct heating
Stencils (templates) 53 in 1 Kaisi S5026 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 7 in 1 for reballing (reball) automotive BGA IC chips with direct heating
Stencils (templates) 35 in 1 Kaisi A90 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 40 in 1 Kaisi A418 for reballing (reball) BGA IC chips with direct heating
Kit of platform and 6 pieces stencils (templates) Amaoe for reballing (reball) EMMC EMCP UFS BGA IC chips with direct heating
Stencils (templates) Amaoe 25 in 1 for reballing (reball) Apple MacBook Pro A1706 / A1707 BGA IC chips with direct heating
Stencils (templates) chip size for reballing (reball) BGA memory chips with direct heating, 14 pieces
Stencils (templates) universal grid 16 in 1 Amaoe with pitch from 0.3mm to 0.5mm for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 7 in 1 Amaoe with pitch from 0.5mm to 0.8mm for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 8 in 1 BGA153 / BGA162 / BGA169 / BGA200 / BGA221 / BGA254 / BGA297 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) universal grid 56 in 1 Kaisi 55 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 33 in 1 Kaisi A508 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 39 in 1 Kaisi A482 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) 28 in 1 Kaisi A467 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 12 in 1 BGA60 / BGA70 / BGA110 / BGA153 / BGA162 / BGA169 / BGA178 / BGA200 / BGA221 / BGA254 / BGA297 / BGA315 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 16 in 1 BGA153 / BGA162 / BGA221 / BGA254 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) chip size universal grid for reballing (reball) BGA IC chips with direct heating, 10 pieces, v2
Stencils (templates) Amaoe 6 in 1 BGA60 / BGA134 / BGA136 / BGA168 / BGA178 / BGA200 for reballing (reball) BGA IC chips with direct heating
Stencils (templates) Amaoe 15 in 1 for reballing (reball) Apple MacBook Pro A2159 / A1990 / A1989 BGA IC chips with direct heating