KLMAG2GEND-B031 (BGA153)
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IC Chip Samsung KLMAG2GEND-B031 (package: BGA-153), 16GB (128Gb) eMMC module (NAND), new
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IC Chip Samsung KLMAG2GEND-B031 (BGA153), 16GB eMMC module (NAND), new
IC Chip Samsung KLMAG2GEND-B031 (package: BGA-153), 16GB (128Gb) eMMC module (NAND), new
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IC Chip Samsung KLMAG2GEND-B031 (package: BGA-153), 16GB (128Gb) eMMC module (NAND), new
Features:
- Memory capacity: 16GB (Gigabytes) / 128Gb (Gigabits)
- IC package: 153FBGA 11.5x13mm (BGA153, BGA-153, 153-ball BGA)
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