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BGA soldering flux Amtech NC-559-ASM, 100 grams

ID: 1753

Reference: NC-559-ASM 100g

Condition: New product

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BGA soldering flux Amtech NC-559-ASM, 100 grams

Flux: NC-559-ASM
Weight: 100 grams

- This product is no-clean solder paste, very little residue, without washing.
- The residue is colorless and transparent look excellent.
- Excellent capacity of solder-stickiness.
- Widely used on BGA, PGA, CSP packages and flip chip operation.
- Suitable for multiple PCB reflow.
- It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates.
- It is a necessary and helpful tool in BGA reballing.