Stencil Amaoe BGA153 / BGA169 for reballing BGA IC chips View larger

Stencil Amaoe BGA153 / BGA169 for reballing BGA IC chips

3072

BGA169 0.15

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Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating

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19.90 лв.

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Warranty 1 month

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Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating

Template thickness: 0.15mm

Note: It is recommended to use solder paste (liquid tin)!

Compatible IC chips:
- eMMC, eMCP, UFS and others in BGA153, BGA169 package

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Stencil Amaoe BGA153 / BGA169 for reballing BGA IC chips

Stencil Amaoe BGA153 / BGA169 for reballing BGA IC chips

Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating

Write a review


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