BGA169 0.15
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Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating
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Stencil Amaoe BGA153 / BGA169 for reballing BGA IC chips
Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating
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Stencil (template) Amaoe BGA153 / BGA169 for reballing (reball) BGA IC chips with direct heating
Template thickness: 0.15mm
Note: It is recommended to use solder paste (liquid tin)!
Compatible IC chips:
- eMMC, eMCP, UFS and others in BGA153, BGA169 package
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